Hotmelt moulding
The hotmelt moulding process (low-pressure moulding) is a cost-effective alternative to injection moulding and traditional potting methods.
Low-pressure encapsulation for the protection of electronic assemblies
The hotmelt moulding process, also known as low-pressure encapsulation, has established itself in recent years as a cost-efficient and process-reliable alternative to conventional injection moulding and potting methods. Particularly for protecting and sealing electronic assemblies, the process offers decisive advantages in terms of component protection, flexibility, and cost structure.
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